At this week’s 2018 IEEE International Interconnect Technology Conference (IITC 2018), imec will present 11 papers on advanced interconnects, ranging from extending Cu and Co damascene metallization, all the way to evaluating new alternatives such as Ru and graphene. After careful evaluation of the resistance and reliability behavior, imec is taking the first steps towards extending conventional metallization into the 3nm technology node.   For almost two decades, Cu-based dual damascene has b...